Staff Engineer Unit Process Development
Infineon Technologies
Tanggal: 1 minggu yang lalu
Kota: Batam, Riau
Jenis kontrak: Penuh waktu

In this role, you will be responsible for molding process development engineer and support package development and lead platform extensions/innovation projects.
In your new role you will:
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
In your new role you will:
- Establish new assembly process capabilities for molding process.
- Identify process deviations and implement corrective actions.
- Support package development projects and lead platform extensions/innovation projects.
- Perform data gathering and statistical analysis to confirm stability of the established process.
- Conduct process knowledge transfer to the manufacturing team.
- Ensure all lessons learnt are well understood and documented.
- Proactively work and propose solutions to ensure best in class time to market for Infineon products
- Education qualification in Master / Bachelor Degree in Mechanical/Materials/Process Engineering.
- Minimum 5 Years of IC/Semiconductor assembly industry.
- Possess in-depth knowledge in Molding process, equipment, materials, and their interactions.
- Independent with good communication and coordination skills.
- Demonstrates an ability to lead a team in problem-solving.
- Analytical mind and high initiative to challenge him/herself to move the next level of competency.
- Knowledgeable in IC Packaging Assembly Process Flow.
- Experience in analytical tools (i.e. JMP, 8D, FMEA, SPC, DMAIC approach to problem solving) and design of experiments.
- The ability to break down problems to simple and structured manner using problem solving methodology
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
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