Staff Engineer Unit Process Development

• Establish and setup new assembly process capabilities including hands-on equipment setup.
• Identify problems or deviations and recommend and implement corrective actions.
• Enable new package development, ramp up, platform extensions and innovations.
• Derive and define new process design guidelines for new package technologies.
• Perform data gathering according to Process Development Handbook requirements and recorded into SPC tools.
• Support end-to-end needs on tooling and machine ramp-up requirements.
• Conduct process knoweldge transfer to Segment team. Ensure all lessons learned are well explain and understood.

• Masters / Bachelor Degree in Engineering with minimum 5 Years of IC/Semiconductor assembly industry.
• Possess in-depth knowledge in Molding process, equipment and material, and their interactions.
• Analytical mind and high initiative to challenge him/herself to move the next level of competency.
• Knowledgeable in IC Packaging Assembly Process Flow
• Experience in analytical tools (i.e. JMP, 8D, FMEA, SPC, DMAIC approach to problem solving) and design of experiments.
• Tooling Design and Simulation knowledge will be an added advantage

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